Bostik SL C955 ADVANCED is a two-part, high-performance smoothing compound that doesn’t require intensive subfloor preparation – saving you both time and money!
With exceptional flow characteristics, it can be applied directly to most common substrates without priming due to its high adhesion and low shrinkage properties, including old adhesive residues, ceramic tiles, Bostik damp proof membranes, flooring grade plywood, and resin flooring.
